infineon IGBT安装原理

infineonIGBT安装原理ApplicationNoteDatum:19-12-2005Seite1AN-Nummer:AN-2006-02Abteilung:AIMPMDIDAEApplicationofscreenprinttemplatestopastethermalgreasewithinIGBTmodulesIntroductionWhenoperatingsemiconductormodulesthepowerlossesneedtobetransferredtoaheatsinkinordernottoexceedthemaximumjunctiontemperatureofthecomponents.Thermalcompoundisnormallyusedtoaidthermalcontactbetweenmoduleandheatsink.Bothunevennessofthebaseplateandsurfaceroughnessoftheheatsinkarethuscompensated.Thefollowingintroducesthescreenprintprocesstoapplythermalcompounds.ScreenprinttemplateContrar