J-std-020cprofilestandard

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices(2008.3)

J-STD-033A 标准，Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

MIL-STD-883J

J-STD-020CProposedStdJan04

J-STD-001E-English, Requiremens for soldered electrical and electronic assemblies

本补充标准专用于补充或替代IPC J-STD-001 E版中的对应要求,以确保焊接的电气和电子组件在进入太空和在太空中运行时的振动与热循环条件下的可靠性。

J-STD-004BwAmend1-Chinese

J-STD-033 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

IPC-J-STD-001H: Requirements for Soldered Electrical and Electronic Assemblies

IPC J-STD-001D是针对焊接材料和工艺的唯一行业通行标准,描述了焊接的电气和电子组件所用的材料、方法和验收标准。