东芝emmc芯片手册,THGBMBG9D8KBAIGis64GBdensityofe-MMCModuleproducthousedin153ballBGApackage.ThisunitisutilizedadvancedTOSHIBANANDflashdevice(s)andcontrollerchipassembledasMultiChipModule.THGBMBG9D8KBAIGhasanindustrystandardMMCprotocolforeasyuse.