HybridMemoryCube(HMC)isasinglepackagecontainingfourDRAMdieandonelogicdie,allstackedtogetherusingthrough-siliconvia(TSV)technology.Withineachcube,memoryisorganizedvertically—portionsofeachmemorydiearecombinedwiththecorrespondingportionsoftheothermemorydieinthestack.Eachgroupingofme