Standard=.010”(250μm)Hole-to-Copper Imaging-Front-to-Back=/-.002”(50μm) Lamination-layer-to-layerregistration=/-.004”(100μm) Drill-Drilltolerance=/-.003”(75μm) TotalTolerance=.009”(225μm) Advanced=.008”(200μm)Hole-to-Copper Imaging-Front-to-Back=/-