Size Effect of Copper Upon Electroless Initiation
铜尺寸对引发化学镀的影响,胡光辉,潘湛昌,实验发现孤立的小铜盘(0.1mm)比尺寸大的铜盘(>0.1mm)更难引发化学镀过程,也即小铜盘上易发生漏镀现象。主要原因可能是在置换反应过程
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