infineonIGBT电源循环测试ReliabilityofSubstrateSolderJointsfromPowerCyclingTestsThomasHunger,InfineonTechnologiesAG,Warstein,GermanyReinholdBayerer,InfineonTechnologiesAG,Warstein,GermanyAbstractThelifetimeofthesolderjointbetweenbaseplateandceramicsubstrateisusuallytestedbypassivelyheatingandcoolingtheIGBTmodule(thermalcycling).Thisprovokesfailures(delamination)inthatsolderlayer.But,theIGBTanddiodediesareactivelyheatedintheapplication.Otherfailuremodes(e.g.bondwireliftoff)areaddressedandlimitthelifetime.Thiskindofstressisusuallytestedviapowercycling.Inthepresentpaperthepowercyclingtestresultsareevaluatedwithrespecttofailuresinthesubstratesolder.Thosetestswiththeirhighnumberofcyclesareutilize
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