温度传感器和1-Wire器件封装的热电阻值（的Theta JA ，θ JC ）

摘要：两种常见的IC封装热阻的测量值是结到环境（的ThetaJA）和结点到外壳（西塔赛马）。这些参数计算最大功耗和自发热，和封装类型比较有用的。选择Maxim的温度传感器和1-Wire®器件的ThetaJA和Theta赛马值这里介绍。计算值的例子。

Maxim>DesignSupport>TechnicalDocuments>ApplicationNotes>1-WireDevices>APP3930Maxim>DesignSupport>TechnicalDocuments>ApplicationNotes>GeneralEngineeringTopics>APP3930Maxim>DesignSupport>TechnicalDocuments>ApplicationNotes>MeasurementCircuits>APP3930Keywords:ThetaJA,ThetaJC,theta-ja,theta-jc,selfheating,thermaldissipation,heatdissipation,powerdissipation,thermalresistance,junctiontocase,junctiontoambient,temperature,sensor,temperaturesensor,thermalNov16,2006APPLICATIONNOTE3930PackageThermalResistanceValues(ThetaJA,ThetaJC)forTemperatureSensorsand1-W