The effects of vias on PCB tra

HFSSdifferentialvias

基于C#的简单XML处理工具，转换文件为Trados可处理格式

Transportation(LE-TRA)

创建ok6410文件系统时使用的配置文件

Wideband modeling and characterization of differential through-silicon vias for 3-D ICs

全套的AE 插件Final Effects、Next Effects、 Studio Effects

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A Model of Air-Gap Through- Silicon Vias (TSVs) for Millimeter Application

NULL 博文链接：https://aheadjava.iteye.com/blog/308932

FEATURESPower dissipaTIonPCM : 0.3 W（Tamb=25℃）Collector currentICM : -0.5 ACollector-base voltageV(B