oustar

Thismethodestablishesastandardprocedurefortestingandclassifyingmicrocircuitsaccordingtotheir susceptibilitytodamageordegradationbyexposuretoadefinedel

solderbilitytestforcomponentleads,terminations,lugs,terminalsandwires

Vibration,VariableFrequency

Temperature,Bias,andOperatingLife