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对cpu散热研究综述，随着芯片集成度的不断提高,为CPU 提供有效的散热方案成为电子行业的重要研究课题.针对CPU 热障问题,着重讨论了热管、微通道和制冷芯片3 种新型微冷却方式的发展现状、传热原理以及应用前景,分析了它们各自的优缺点和有待解决的问题,并对这一领域的发展前景作了展望

Heat transfer continues to be a field of major interest to engineering and scientific researchers, as well as designers, developers, and manufacturers