infineonTO封装尺寸相关数据AdditionalInformation,DS1,March2008RecommendationsforAssemblyofInfineonTOPackagesEdition2008-03PublishedbyInfineonTechnologiesAG81726München,Germany2008InfineonTechnologiesAGAllRightsReserved.LegalDisclaimerTheinformationgiveninthisdocumentshallinnoeventberegardedasaguaranteeofconditionsorcharacteristics.Withrespecttoanyexamplesorhintsgivenherein,anytypicalvaluesstatedhereinand/oranyinformationregardingtheapplicationofthedevice,InfineonTechnologiesherebydisclaimsanyandallwarrantiesandliabilitiesofanykind,includingwithoutlimitation,warrantiesofnon-infringementofintellectualpropertyrightsofanythirdparty.InformationForfurtherinformationontechnology,deliverytermsandco

infineon TO封装尺寸相关数据

infineon TO封装尺寸相关数据